A2F060M3E-1FG256M
Specifications
Category:
Integrated Circuits (ICs)
Embedded
System On Chip (SoC)
Base Product Number:
A2F060M3E
Product Status:
Obsolete
Peripherals:
DMA, POR, WDT
Primary Attributes:
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Series:
SmartFusion®
Package:
Tray
Mfr:
Microsemi Corporation
Supplier Device Package:
256-FPBGA (17x17)
Connectivity:
EBI/EMI, I²C, SPI, UART/USART
Operating Temperature:
-55°C ~ 125°C (TJ)
Architecture:
MCU, FPGA
Package / Case:
256-LBGA
Number Of I/O:
MCU - 26, FPGA - 66
RAM Size:
16KB
Speed:
100MHz
Core Processor:
ARM® Cortex®-M3
Flash Size:
128KB
Highlight:
A2F060M3E-1FG256M
,A2F060M3E-1FG256M Integrated Circuits IC
Introduction
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops 100MHz 256-FPBGA (17x17)
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Stock:
In Stock
MOQ: