XCVE1752-1LSEVSVA2197
Specifications
Category:
Integrated Circuits (ICs)
Embedded
System On Chip (SoC)
Product Status:
Active
Peripherals:
DDR, DMA, PCIe
Primary Attributes:
Versal™ AI Core FPGA, 1M Logic Cells
Series:
Versal™ AI Core
Package:
Tray
Mfr:
AMD
Supplier Device Package:
2197-FCBGA (45x45)
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature:
0°C ~ 100°C (TJ)
Architecture:
MPU, FPGA
Package / Case:
2197-BFBGA, FCBGA
Number Of I/O:
608
RAM Size:
-
Speed:
400MHz, 1GHz
Core Processor:
Dual ARM® Cortex®-A72 MPCore™ With CoreSight™, Dual ARM®Cortex™-R5F With CoreSight™
Flash Size:
-
Highlight:
XCVE1752-1LSEVSVA2197
,XCVE1752-1LSEVSVA2197 Integrated Circuits IC
Introduction
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ AI Core Versal™ AI Core FPGA, 1M Logic Cells 400MHz, 1GHz 2197-FCBGA (45x45)
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Stock:
In Stock
MOQ: