XCZU7CG-1FBVB900E
Specifications
Category:
Integrated Circuits (ICs)
Embedded
System On Chip (SoC)
Base Product Number:
XCZU7
Product Status:
Active
Peripherals:
DMA, WDT
Primary Attributes:
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Series:
Zynq® UltraScale+™ MPSoC CG
Package:
Tray
Mfr:
AMD
Supplier Device Package:
900-FCBGA (31x31)
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature:
0°C ~ 100°C (TJ)
Architecture:
MCU, FPGA
Package / Case:
900-BBGA, FCBGA
Number Of I/O:
204
RAM Size:
256KB
Speed:
500MHz, 1.2GHz
Core Processor:
Dual ARM® Cortex®-A53 MPCore™ With CoreSight™, Dual ARM®Cortex™-R5 With CoreSight™
Flash Size:
-
Highlight:
XCZU7CG-1FBVB900E
,XCZU7CG-1FBVB900E Integrated Circuits IC
Introduction
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 504K+ Logic Cells 500MHz, 1.2GHz 900-FCBGA (31x31)
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Stock:
In Stock
MOQ: